도금서비스

- High Aspect Ratio Electroplating 1 : 2.5
- High Precise Design Implementation
- Electroless/Electroplating Technology : Au, Ni, NiCo, Cu, SnAg etc.

	Plating Type	Plating Materials	Plating Method
1	4", 6"wafer	Au, Ni, NiCo, SnAg etc.	Electroless Plating Electro Plating
2	Substrate Size less than 6" or special Shape	Same	Same